Package plays critical role for the performance and cost of RF Power product. By strategic cooperation with leading RF Power package suppliers in the world, Innogration is offering our products in form of broad package choices either standard off-shelf options or highly customized solutions

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Typical ceramic package

• Broadest choices including CuW, CPC, SCMC, Copper flanged

• Full body headers and lids, plated flange and mini pack product form

• Eared or Earless for customer preference

• Proven ,mainstream, high volume package from top suppliers

• Focus on epoxy lid sealing(with hermetical sealing optional for selective cases)

Typical plastic package

DFN overmolded: 4*4mm(PD), 4*4.5mm(P2),6*5mm(P3), 7*6.5mm(P5)

QFN overmolded:7*7mm(P4),10*6mm(P6),8*8mm (P8) 

QFN open cavity (Patent granted):10*6mm(C6), 12*10mm(C9)

Typical package for GaN IMFET

30*27mm

Main Package Pictures: